Nanotechnology Packaging Market Share, Growth, Industry Forecast to 2030

The global nanotechnology packaging market size was valued at USD 22.83 billion in 2022 and is projected to be USD 26.13 billion in 2023 to USD 73.10 billion by 2030, exhibiting a CAGR of 15.83% during the forecast period.

The global nanotechnology packaging market size was valued at USD 22.83 billion in 2022. The market is anticipated to expand from USD 26.13 billion in 2023 to USD 73.10 billion in 2030, exhibiting a CAGR of 15.83 % over the estimated period.

Nanotechnology-based packaging, often referred to as nano packaging, is a specialized field of packaging technology that utilizes nanomaterials and nanoscale engineering techniques to develop packaging solutions with unique and advanced characteristics. The market is expected to gain grip due to an increasing focus on sustainable packaging solutions to reduce waste and enhance recyclability.

Fortune Business Insights™ provides this information in its research report, titled “Nanotechnology Packaging Market, 2023-2030”.

Source:

https://www.fortunebusinessinsights.com/nanotechnology-packaging-market-108811

COVID-19 Impact:

Increased Demand for Products with Antimicrobial Properties Propelled Market Growth

The pandemic highlighted the critical need for packaging with resilient antimicrobial properties. Consumers and industries sought packaging solutions that could help reduce the risk of bacterial and viral contamination, thus creating a self-cleaning effect. This increased awareness drove the demand for nanotechnology packaging amid COVID-19 pandemic.

Report Coverage:

The report gives a comprehensive analysis of the leading factors favoring the industry growth over the coming years. It focuses on key aspects such as product type, modality, and leading companies. The report further provides insight into the major trends boosting the global business scenario. The impact of the COVID-19 pandemic on market growth is also included in the report.

Restraint & Factors:

Nanotechnology-based indicators or sensors are integrated into the packaging matrix, where they interact with internal and external factors, enabling continuous monitoring of the quality of packaged goods. Features such as improved, smart, intelligent, and active packaging can extend the shelf life of products.